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1, 5G ultra-thin VC outlook We maintain the next 2 to 3 years of ultra-thin VC as a key heat dissipation element of 5G smart phones unchanged, 

and due to the uncertainty of high-end chip supply, the performance of 5G smart phones and high power consumption heating contradiction may intensify, 

or promote the demand for heat dissipation products.

2, stainless steel ultra-thin VC

Stainless steel ultra-thin VC has expanded its market share since 4Q20, and is expected to account for 10%-15% of the ultra-thin VCmarket in 2020. 

Stainless steel ultra-thin VC can be used as structural parts, large flat surface products with high smoothness and strength,

 relying on the area in exchange for a larger heat dissipation wattage, and the integrated heat dissipation of the frame VC, etc., which is favored by various terminal brands. 

The process will turn to stainless steel mesh sintering, cover plate stamping (stainless steel VC support column is easier to ensure stamping accuracy), 

laser packaging, which has an impact on the traditional process brazing and etching.

We predict that ultra-thin stainless steel VC from 2Q21 comparable to ultra-thin alloy copper VC through yield, coupled with relatively low material cost,

 fast stamping and fast welding packaging process, ASP decline, will form a competitive advantage over copper VC.

3, capillary process

We predict that since 4Q20, the copper mesh capillary process has faced the impact of the printed capillary process, 

and the printed capillary has achieved comprehensive advantages in automation and water absorption properties,

 which will drive new industry opportunities such as capillary paste and screen printing.

4. Automation

At this stage, ultra-thin VC cooling plants are facing the challenge of automated processes, and the crowd strategy will not be sustainable. 

Precision ceramic water injection pump water degassing, insert welding rat tail, placing copper mesh and other sections of semi-automation demand is strong, 

and the ultra-thin VC wire body built with reference to ordinary VC equipment faces great challenges in productivity improvement.

We suggest that the automation program should comprehensively evaluate the capacity matching of each section, 

and the limited scale enterprises are mainly semi-automated, and the new investment project should evaluate the strength matching of the automation equipment team,

and the lack of technical personnel will lead to the automation line body can not be opened. According to our integrated supply chain information, since 4Q20, 

there will be 2 to 3 more mature automation solution providers to choose from in the mainland supply chain.

With the maturity of automation, the production of ultra-thin VC will be concentrated in the head of the mobile phone supply chain, 

and the survival pressure of smaller VC projects will increase.

5, ultra-thin VC industry suggestions

At this stage, the ultra-thin VC process route has not yet been finalized, the maturity of automation programs also needs time to accumulate,

 and the investment in equipment and line body programs needs to be cautious. We believe that 4Q20 to 1Q21 will again appear in the ultra-thin VC investment window, 

and new projects will be concentrated in the mobile phone supply chain enterprises, and the industry concentration will be further increased.